JPH0132742Y2 - - Google Patents
Info
- Publication number
- JPH0132742Y2 JPH0132742Y2 JP273884U JP273884U JPH0132742Y2 JP H0132742 Y2 JPH0132742 Y2 JP H0132742Y2 JP 273884 U JP273884 U JP 273884U JP 273884 U JP273884 U JP 273884U JP H0132742 Y2 JPH0132742 Y2 JP H0132742Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor element
- plate
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 230000017525 heat dissipation Effects 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP273884U JPS60116248U (ja) | 1984-01-12 | 1984-01-12 | 半導体素子の放熱板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP273884U JPS60116248U (ja) | 1984-01-12 | 1984-01-12 | 半導体素子の放熱板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60116248U JPS60116248U (ja) | 1985-08-06 |
| JPH0132742Y2 true JPH0132742Y2 (en]) | 1989-10-05 |
Family
ID=30476699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP273884U Granted JPS60116248U (ja) | 1984-01-12 | 1984-01-12 | 半導体素子の放熱板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60116248U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2570832Y2 (ja) * | 1992-02-28 | 1998-05-13 | 日本電気株式会社 | 半導体用ヒートシンク |
-
1984
- 1984-01-12 JP JP273884U patent/JPS60116248U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60116248U (ja) | 1985-08-06 |
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